PRODUCTS: local protection mask ÐËÇ-1
ÐËÇ-1 is designed to locally protect printed-circuit areas from exposure to reagents and/or to Pb/Sn alloy.
ÐËÇ-1 is an explosion- and fireproof, odorless and ductile compound
ÐËÇ-1 has excellent adhesion to printed circuit coats such as copper, Pb/Sn, resist mask, etc.
ÐËÇ-1 can endure without decomposition the action of in the PCB production used plating solutions, such as:
- Copper sulfate electrolyte
- Fluoborate electrolyte used for the Pb/Sn deposition
- Sulfur acid electrolyte for nickel plating
- Dicyan aurate electrolyte for gold plating
ÐËÇ-1 can endure without decomposition the action of solder melts at:
- HASL with the Ò=240 0Ñ and the hot air pressure from 2,5 to 3,5 at.
- Wave soldering with the Ò=265+- 5 0Ñ for 10 s.
ÐËÇ-1 is screen printable
The heat treatement conditions are as follows:
- Either convective drying at Ò=150-160 0Ñ for 15 min., or
- IR-drying at Ò=160-180 0Ñ for 2 or 3 min.
ÐËÇ-1 can be easily stripped away manually.
