№

Operation

Теmperature, єС

Treatment time,
min.

Note

1

Cleaning
(ПлатаМет 601)

20 - 30

3-4

Sulfuric acid cleaner that allows a soft chemical treatment without using any alkaline solution. Such an approach provides a possibility for chemical processing of panels that have a pattern of alkali-soluble photoresist on the surface. The cleaner is easily removable with cold water.

2

Microetching
(ПлатаМет 602)

20 - 25

1-2

Microetcher gives the needed roughness to the copper surface, just ensuring the maximum layer-to-base adhesion. Due to the high stability of solution components, both the process speed and the pre-tretment quality remain at the constant levels during the long operating period.

3

Sulfuric acid 10% solution dipping

18 - 25

0.3-0.5

4

Copper Electroplating
(ПлатаМет 604)

20 - 30

Until the required copper film thickness is obtained

Copper plating electrolyte features a high throwing power resulting in the uniform copper deposition both over the surface and inside the holes. The copper thickness ratio between the surface and the hole-wall is close to 1:1.