TECHNOLOGIES: direct metallization ÏÌ 300
CONCENTRATES FOR DIRECT METALLIZATION PROCESSES
The PM 500 direct metallization process eliminates the need in the electroless copper plating
Basic Process Steps and Concentrates Involved:
Item # |
Concentrate |
Temperature, 0C |
Time, min. |
1.
2.
3.
4. |
PM 502: Conditioner
PM 503: Flash plating
PM 504: Metal plating
PM 505: Acceleration |
70 – 80
40 - 45
60 – 65 |
5 - 10
0,5 - 1
5 - 10
5 - 10 |
Merits of the PM-Processed Boards
- Excellent adhesion to the hole barrels
- Perfect ductility in contrast to electroless copper plating
- Compliance to all requirements of thermal shock stability
Merits of the PM-Process
- Such substances as formaldehyde, cancerogenes and/or complexing agents are not used in the process.
- Reduced volume of discharged solutions.
- There is no need in dumping copper-containing solutions.
- Reduced lead-time
- There is no need to take into account a load factor.
- Applicable to metal plating PCBs with high ratios between the board thickness and the hole size.
- Applicable for processing microvias (both blind and through-hole)
The direct plating technique offers a simple and reliable method for metal plating of PCB holes providing:
- Minimum consumption of reagents
- Reduced lead-time
- High quality of produced PCBs
- High compliance to ecological standard requirements
- Reduced production cos
