TECHNOLOGIES: Deposition of Organic Solderability Preservative ÎÇÏ 900
ÎÇÏ 900 Process is the finish coat deposition on the contact pads that are not protected with a mask. The finish coat ensures the flatness of contact pads which is necessary for automatic surface mounting of components. The process is an alternative to Hot-Air Solder Leveling (HASL). Owing to its inherent high thermal stability, this coating is usable in the combined assembly technique. The ÎÇÏ 900 coat ensures the stable performance of printed boards in accordance with the Russian Standard GOST 23752.
ÎÇÏ 900 Basic Process Stages
¹ |
Operation |
Òåmperature, ºÑ |
Treatment time,
min. |
Note |
1 |
Cleaning
(ÎÇÏ 901) |
20 - 30 |
2-4 |
Cleaner efficiently removes contamination from the surface without any aggressive attack both on mask and on conductors. |
2 |
Microetching
(ÎÇÏ 902) |
20 - 25 |
1-2 |
Microetcher renews the copper surface due to etching off the top layer (from 1 to 2 microns of thick) just forming the surface structure that is the most suitable to further coating. |
3 |
Hydrochloric acid 10% solution dipping |
18 - 25 |
0.3-0.5 |
Copper surface is activated before organic film will be produced. |
4 |
Deposition
(ÎÇÏ 904) |
38 - 43 |
1 |
Is deposited in aqueous solution at a moderate temperature and thus has no action (like the thermal shock) upon the boards. This factor undeniably has the positive contribution to the long operating life of PCBs. |
