TECHNOLOGIES: electroless copper ÝËÕÌ 200
ÝËÕÌ 200 process is characterized by a number of indisputable advantages such as:
- high stability and high quality of the hole metallization;
- the copper plating equally well covers both epoxy resin and glass;
- deposited copper is fine-grained, bright and easily controlled inside holes;
- drastically decreased load on purification works due to the use of low-concentrated solutions.
ÝËÕÌ 200: The basic process stages and materials used
| ¹ |
Îperation |
Òåmperature, ºÑ |
Processing time, min. |
Note |
1
|
Conditioning
(ÝËÕÌ 201) |
65-70
|
5-7
|
Conditioner effectively cleans surface and removes electrostatic charges from hole-walls along with it. The surface when treated is loosening to give an effective palladium adsorption in the following activation. |
2 |
Microetching
(ÝËÕÌ 202) |
18-25 |
1 - 2 |
Microetcher produces the wanted structure of copper surface just enabling the best adhesion between the surface and the layers deposited. |
3 |
Pre-activation
(ÝËÕÌ 203) |
18-25 |
0.5 – 1.0 |
|
4
|
Activation
(ÝËÕÌ 204)
|
40-45
|
5 - 6
|
When activator is used active palladium centers are deposited on the dielectric surface. They serve as a catalyst for the chemical copper plating.
In this process, in spite of a low palladium concentration, the activator promotes forming a dense continuous film of chemical copper. Thanks to the low palladium concentration activation offers an essential saving in precious metal. |
5
|
Electroless copper plating (ÝËÕÌ 205)
|
40-45
|
15-20
|
Electroless copper plating features high stability of the solution and does not require any continuous filtration since there is no copper deposition on the tank-walls during the process.
The deposited electroless copper is dense and highly conductive. The low operating concentrations of solution components make the waste water purification much easier. |
